PCB Manufacturing
Technologies
Facilities

Rigid Circuit Board: 1 - 20 layers

Major Material Suppliers are included
- ShengYi, Kingboard, Isola, ITEQ
- HuaZheng New Material, Goldenmax

Flexible and Flex-Rigid Mixed Board (1~8 layers)

Material types are included:
- Polyimide,
- Polyester
- FR-4

Major Material Suppliers are included
- ShengYi, Grace, ATME, DongYi

Lead Time

PCB Prototype Fabrication (3 ~ 5 working days)
PCB Pilot Run Production (5 ~ 15 working days)
PCB Volume Production (15 ~ 20 working days)

Surface Finishing

1. HASL and Lead Free HASL
2. Flash Gold Plating
3. Gold Edge Connector (fingers, Tabs)
4. Selective Thick Gold Plating
5. Immersion Gold / Tin / Silver
6. Entek Coating (OSP)
7. Pre-flux

General Capability

Max Panel Size: 457.2 x 609.6mm (18” x 24”)
Board Thickness: 0.20mm ~ 3.20mm (8mil ~ 126mil)
Finished Copper: H oz ~ 4 oz (18 ~ 140 micron)
Min. Trace Width: 0.09mm (3.5mil)
Min. Trace Spacing: 0.09mm (3.5mil)
Min. Hole Size: 0.20mm (8mil)
Aspect Ratio: 8:1
Layer to Layer Registration: 5mil
Impedance Control: +/-10%
Warpage: <=1%
Extra Process:
- HDI, Blind/Buried, Buried Via
- Peelable Solder Mask
- Carbon Ink Printing
- Solder Mask Plugged Hole
Profiling: Routing, Punching, V-cut and Chamfer

Qualification

UL Certification
IPC - A-600G Class II & Class III
ISO9001:2008
ISO14001:2004
ISO/TS16949:2002